Post exposure bake (PEB) heater

Wed, 17 Jun 2026 11:10:55 +0800

On the lithography floor, PEB temperature uniformity across the wafer is what actually drives CD control and overlay. A drift of even a few tenths of a degree throws off the photoresist chemical amplification, shifts bias, and changes etch selectivity—and that’s how you burn hours on exposure and metrology for nothing. What matters, technically We build the PEB heater around wafer-level thermal uniformity of ±0.1°C, and we hold photoresist bake temperature right on setpoint through the entire bake profile. The platform runs both soft bake and hard bake, with ramp rates that repeat—so you stop chasing thermal budget drift between lots. Quartz-halogen short-wave emitters give you fast, clean response, and the hot-zone geometry is tuned to keep edge-to-edge balance consistent. For cleanroom Class 1–100, we use low-outgassing materials and engineer for zero particle generation under normal operation, so particle counts stay in spec without stacking on extra filtration. It’s built to run 24/7 in multi-shift fabs with zero unplanned downtime, and the energy profile is managed to keep cost per wafer stable. Why it holds up in a real fab You need a bake that behaves the same at 3 a.m. as it does at 3 p.m., across process splits and different wafer sizes. This PEB heater locks down the post-exposure bake step, so CD control and overlay stay in spec, and etch transfer stays predictable. The payoff is fewer reworks, tighter distributions, and a cycle time you can plan around. What you need to know up front Installation hinges on tight integration with the track’s thermal interface and exhaust. You’ll run a short alignment and bake profile mapping for each photoresist stack. Once that’s set, the heater’s repeatability cuts down on setups—but that initial qualification is not optional.

(PEB) on Expert Warm IR Heating Solutions

Post exposure bake (PEB) heater