Post exposure bake (PEB) heater

Wed, 17 Jun 2026 11:10:55 +0800

On the lithography floor, PEB temperature uniformity across the wafer is what actually drives CD control and overlay. A drift of even a few tenths of a degree throws off the photoresist chemical amplification, shifts bias, and changes etch selectivity—and that’s how you burn hours on exposure and metrology for nothing. What matters, technically We build the PEB heater around wafer-level thermal uniformity of ±0.1°C, and we hold photoresist bake temperature right on setpoint through the entire bake profile. The platform runs both soft bake and hard bake, with ramp rates that repeat—so you stop chasing thermal budget drift between lots. Quartz-halogen short-wave emitters give you fast, clean response, and the hot-zone geometry is tuned to keep edge-to-edge balance consistent. For cleanroom Class 1–100, we use low-outgassing materials and engineer for zero particle generation under normal operation, so particle counts stay in spec without stacking on extra filtration. It’s built to run 24/7 in multi-shift fabs with zero unplanned downtime, and the energy profile is managed to keep cost per wafer stable. Why it holds up in a real fab You need a bake that behaves the same at 3 a.m. as it does at 3 p.m., across process splits and different wafer sizes. This PEB heater locks down the post-exposure bake step, so CD control and overlay stay in spec, and etch transfer stays predictable. The payoff is fewer reworks, tighter distributions, and a cycle time you can plan around. What you need to know up front Installation hinges on tight integration with the track’s thermal interface and exhaust. You’ll run a short alignment and bake profile mapping for each photoresist stack. Once that’s set, the heater’s repeatability cuts down on setups—but that initial qualification is not optional.

Uniformity photoresist bake lamp

Wed, 10 Jun 2026 01:35:24 +0800

On the fab floor, a 0.2°C drift in soft bake can scrap a whole lot. You watch photoresist thin at the edge, critical dimensions spread, and lithography capacity burn for nothing. This bake lamp was built to stop that drift before it shows up. What matters, technically, is that we engineer the bake profile around the wafer, not the chamber. The lamp holds wafer-level thermal uniformity within ±0.1°C across the full diameter, settles fast, and repeats from lot to lot. Carbon-fiber heating elements and NIR optics give stable, quick response without hot spots. It runs in Class 1–100 cleanrooms and generates zero particles—validated with in-situ particle monitoring. Rated for 7×24, it has delivered zero unplanned downtime across thousands of cycles, and output stays stable over 5,000+ hours. Here is why it works in photoresist processing: temperature accuracy drives solvent evaporation, film thickness, and CD control. The lamp keeps the thermal budget where the process needs it—less rework, better yield, and lower energy because the heat goes where it counts. You get consistent soft bake and hard bake across tools, shifts, and wafer geometries—repeatability you can audit. The lamp drops into existing tracks and bake plates, but alignment and thermal isolation are non-negotiable. Plan for tool-specific mounting, and confirm your thermal interface and power supply match the specified connectors and voltage. Commissioning is short—tune ramp rates and overshoot—and once set, the process stays locked. Maintenance intervals are long; replacements are planned, not emergency stops.

Bake on Expert Warm IR Heating Solutions

Post exposure bake (PEB) heater

Uniformity photoresist bake lamp